发明名称 METHOD FOR MANUFACTURING CONDUCTIVE FILM, AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive film, capable of achieving an efficient progress of reduction of a metal oxide into a metal and yielding a conductive film which exhibits excellent adhesion to a substrate, and to provide a printed wiring board.SOLUTION: The method for manufacturing a conductive film includes: a step of applying a dispersion liquid containing metal oxide particles on a substrate 10 to form a precursor film 12 containing the particles; and a step of irradiating the precursor film with a continuous oscillation laser beam 16 while relatively scanning the film, so as to reduce the metal oxide in an irradiated area by the continuous oscillation laser beam to form a metal-containing conductive film 18. The scanning speed is 1.0 m/s or more; the laser power of the continuous oscillation laser beam is 6.0 W or more; and the irradiation time per one point on the precursor film surface is 1.0 μs or more.
申请公布号 JP2014132565(A) 申请公布日期 2014.07.17
申请号 JP20130248097 申请日期 2013.11.29
申请人 FUJIFILM CORP 发明人 USAMI YOSHIHISA;OTA HIROSHI
分类号 H01B13/00;H05K3/10 主分类号 H01B13/00
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