SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To enable inhibition of breakage and the like at the time of division by dicing even when a semiconductor substrate is a thin layer.SOLUTION: A semiconductor device manufacturing method comprises: thinning a substrate 101 from a rear face side after bonding a first support substrate 104 to a first adhesion layer 103; forming substrate through vias in the substrate 101; performing a rear face process such as forming a rear face wiring pattern on a rear face of the substrate 101; and subsequently dividing the thinned substrate 101 into a plurality of chips 105 by dicing from the rear face of the substrate 101.