发明名称 |
METHOD FOR MANUFACTURING MULTI-GATE TRANSISTOR DEVICE |
摘要 |
A method for manufacturing multi-gate transistor device includes providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer sequentially formed thereon, forming a multiple insulating layer sequentially having a first insulating layer and a second insulating layer and covering the patterned semiconductor layer and the gate layer, removing a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer, removing the second spacer to expose a portion of the first insulating layer covering the patterned semiconductor layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, and removing the exposed first insulating layer to expose the patterned semiconductor layer. |
申请公布号 |
US2014199817(A1) |
申请公布日期 |
2014.07.17 |
申请号 |
US201414219010 |
申请日期 |
2014.03.19 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Tsai Shih-Hung;Lin Chien-Liang;Lin Chien-Ting;Fu Ssu-I;Chen Ying-Tsung |
分类号 |
H01L29/66 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing multi-gate transistor device, comprising:
providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer formed thereon, and the gate layer covering a portion of the patterned semiconductor layer; forming a multiple insulating layer on the semiconductor substrate, the multiple insulating layer covering the patterned semiconductor layer and the gate layer, wherein the multiple insulating layer sequentially has a first insulating layer and a second insulating layer; performing a first etching process to remove a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer; removing the second spacer to expose a portion of the first insulating layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, the first insulating layer still covering the patterned semiconductor layer; and removing the exposed first insulating layer to expose the patterned semiconductor layer. |
地址 |
Hsin-Chu City TW |