发明名称 METHOD FOR MANUFACTURING MULTI-GATE TRANSISTOR DEVICE
摘要 A method for manufacturing multi-gate transistor device includes providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer sequentially formed thereon, forming a multiple insulating layer sequentially having a first insulating layer and a second insulating layer and covering the patterned semiconductor layer and the gate layer, removing a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer, removing the second spacer to expose a portion of the first insulating layer covering the patterned semiconductor layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, and removing the exposed first insulating layer to expose the patterned semiconductor layer.
申请公布号 US2014199817(A1) 申请公布日期 2014.07.17
申请号 US201414219010 申请日期 2014.03.19
申请人 UNITED MICROELECTRONICS CORP. 发明人 Tsai Shih-Hung;Lin Chien-Liang;Lin Chien-Ting;Fu Ssu-I;Chen Ying-Tsung
分类号 H01L29/66 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method for manufacturing multi-gate transistor device, comprising: providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer formed thereon, and the gate layer covering a portion of the patterned semiconductor layer; forming a multiple insulating layer on the semiconductor substrate, the multiple insulating layer covering the patterned semiconductor layer and the gate layer, wherein the multiple insulating layer sequentially has a first insulating layer and a second insulating layer; performing a first etching process to remove a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer; removing the second spacer to expose a portion of the first insulating layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, the first insulating layer still covering the patterned semiconductor layer; and removing the exposed first insulating layer to expose the patterned semiconductor layer.
地址 Hsin-Chu City TW