| 摘要 |
Provided is a curable epoxy resin composition capable of forming a cured product which has high heat resistance, light resistance and thermal-shock resistance, and specifically, improves the conduction properties and moisture-absorption-reflow resistance properties of an optical semiconductor device at high temperatures. A curable epoxy resin composition containing an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by formula (1) (In the formula, R1 and R2 may be identical or different, and represent a hydrogen atom or a C1-8 alkyl group.), a siloxane derivative (C) having two or more epoxy groups in the molecule, a peroxide decomposer (D), a curing agent (E) and a curing accelerator (G), and optionally containing an alicyclic polyester resin (F). |
