DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAPILLARIES

摘要

Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces.

主权项

1. An electronic assembly comprising:
a coolant-cooled electronic module comprising at least one coolant-carrying channel configured to facilitate flow of coolant therethrough and thereby facilitate cooling at least one electronic component of the coolant-cooled electronic module; and a coolant manifold structure detachably coupled to the coolant-cooled electronic module, the coolant manifold structure facilitating flow of coolant to the at least one coolant-carrying channel of the coolant-cooled electronic module, wherein the coolant manifold structure and the coolant-cooled electronic module comprise adjoining surfaces, one surface of the adjoining surfaces comprising a plurality of coolant capillaries, the plurality of coolant capillaries being sized to inhibit leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and coolant-cooled electronic module along the adjoining surfaces.