ELECTROLYTIC COPPER FOIL AND ELECTRONIC DEVICE

摘要

Provided is an extremely useful electrolytic copper foil for an electrode in an electronic device. The electrolytic copper foil according to the present invention is used for an electrode in an electronic device and made of copper or a copper alloy, the electrolytic copper foil having a 0.2% proof-stress of 250 N/mm2 or more after heat treatment for sixty minutes at 200°C in a nitrogen atmosphere, and at least the outermost surface of the electrolytic copper foil is provided with a recess dominant surface having a Pv / Pp ratio of 1.2 or more representing the maximum valley depth (Pv) in a cross-sectional curve to the maximum peak height (Pp) in the cross-sectional curve, which is measured for a rectangular region of 181 μm × 136 μm in accordance with JIS B 0601 - 2001.