Mounting system for applying an RFID chip module to a substrate, in particular a label

摘要

A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label. The system includes a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules. The stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch is disposed above the stamping opening A support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate. A suction device is provided for holding the RFID chip module on the stamping punch. A heating device for melting solder is present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.

主权项

1. A mounting device for attaching an RFID chip module with at least one electrical connection to a substrate with at least one conductor, particularly onto a label, said mounting device comprising:
a punching device for punching out the RFID chip module from a carrier tape with a plurality of chip modules, wherein the punching device comprises a punching matrix with a punching aperture for positionally accurately receiving an RFID chip module to be punched out and a punching die arranged above the punching aperture,wherein under the punching opening there is disposed a support for positionally accurately receiving a substrate and wherein the punching die is displaceable towards and against the substrate;
a suction device for holding the RFID chip module to the punching die and; a heating device for melting any soldering means present on the RFID chip module for producing a conductive connection between each of an electrical connection of the RFID chip module and a respective conductor of the substrate.