Illumination device for enhancing plant growth

摘要

An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module. The control unit includes a first PWM control module electrically connected to the first current-limiting chip, a second PWM control module electrically connected to the second current-limiting chip, and a third PWM control module electrically connected to the third current-limiting chip.

主权项

1. An illumination device for enhancing plant growth, comprising:
a substrate unit including a substrate body having a first chip-placing region, a second chip-placing region, and a third chip-placing region, wherein the first chip-placing region, the second chip-placing region, and the third chip-placing region are disposed on the top surface of the substrate body; a light-emitting unit including a first light-emitting module for generating a first optical wavelength, a second light-emitting module for generating a second optical wavelength, and a third light-emitting module for generating a third optical wavelength and a predetermined color temperature, wherein the first light-emitting module includes a plurality of first LED chips disposed on the first chip-placing region and electrically connected to the substrate body, the second light-emitting module includes a plurality of second LED chips disposed on the second chip-placing region and electrically connected to the substrate body, and the third light-emitting module includes a plurality of third LED chips disposed on the second chip-placing region and electrically connected to the substrate body; a current-limiting unit including a first current-limiting chip disposed on the substrate body and electrically connected to the first light-emitting module, a second current-limiting chip disposed on the substrate body and electrically connected to the second light-emitting module, and a third current-limiting chip disposed on the substrate body and electrically connected to the third light-emitting module; a control unit including a first PWM control module disposed on the substrate body and electrically connected to the first current-limiting chip, a second PWM control module disposed on the substrate body and electrically connected to the second current-limiting chip, and a third PWM control module disposed on the substrate body and electrically connected to the third current-limiting chip; a frame unit including a first surrounding colloid frame, a second surrounding colloid frame, and a third surrounding colloid frame, wherein the first surrounding colloid frame, the second surrounding colloid frame, and the third surrounding colloid frame are surroundingly formed on the top surface of the substrate body, the first surrounding colloid frame surrounds the first LED chips to form a first colloid position limiting space corresponding to the first chip-placing region, the second surrounding colloid frame surrounds the second LED chips to form a second colloid position limiting space corresponding to the second chip-placing region, and the third surrounding colloid frame surrounds the third LED chips to form a third colloid position limiting space corresponding to the third chip-placing region; and a package unit including a first package colloid body filled into the first colloid position limiting space to cover the first LED chips, a second package colloid body filled into the second colloid position limiting space to cover the second LED chips, and a third package colloid body filled into the third colloid position limiting space to cover the third LED chips, wherein the first package colloid body is surrounded by the first surrounding colloid frame, the second package colloid body is surrounded by the second surrounding colloid frame, and the third package colloid body is surrounded by the third surrounding colloid frame.