| 摘要 |
Breaker nanoparticles may be added to gelled aqueous fluids where the gelled aqueous fluid may include an aqueous base fluid, e.g. a drilling fluid, gelled with at least one viscoelastic surfactant (VES) in an amount to increase the viscosity of the aqueous base fluid. The addition of the breaker nanoparticles may reduce the viscosity, or break the gel, of the gelled aqueous fluid by the direct or indirect action of the breaker nanoparticles. The breaker nanoparticles may be or include, but are not limited to inorganic semiconductor particles, organic semiconductor particles, and combinations thereof. The inorganic semiconductor particles may be or include, but are not limited to cupric oxide, cuprous oxide, silicon, silicon carbide, germanium, and gallium arsenide, indium antimonide, gallium nitride, and combinations thereof; wherein the organic semiconductors selected from the group consisting of pentacene, anthracene, rubrene, poly(3-hexylthiophene), poly(p-phenylene vinylene), polypyrrole, polyaniline, and combinations. |
| 主权项 |
1. A method for breaking the viscosity of a gelled aqueous fluid where the gelled aqueous fluid comprises an aqueous fluid gelled with at least one viscoelastic surfactant (VES), wherein the method comprises adding breaker nanoparticles to a gelled aqueous fluid, wherein the breaker nanoparticles are added to the gelled aqueous fluid in an effective amount to decrease the viscosity of the gelled aqueous fluid as compared to a gelled aqueous fluid absent the breaker nanoparticles; and wherein the breaker nanoparticles are selected from the group consisting of cupric oxide, cuprous oxide, inorganic semiconductors, organic semiconductors, and combinations thereof. |
