Wiring board, semiconductor apparatus and method of manufacturing them

摘要

There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step.

主权项

1. A wiring board comprising a dielectric layer and a wiring layer,
wherein one surface of said wiring board serves as a semiconductor device mounting surface and the other surface which is opposed to the surface of said wiring board serves as an external connecting terminal surface, wherein a surface of the dielectric layer comprises the external connecting terminal surface and is formed as a roughened surface that forms an outer surface outline of the wiring board, wherein a connecting pad is embedded in the dielectric layer and a front surface of the connecting pad is exposed to the roughened surface of the dielectric layer, and wherein the wiring layer has a via and an end surface of the via is connected to a rear surface of the connecting pad.