发明名称 |
GST CMP slurries |
摘要 |
The present invention provides chemical-mechanical polishing (CMP) compositions suitable for polishing a substrate comprising a germanium-antimony-tellurium (GST) alloy. The CMP compositions of the present invention are aqueous slurries comprising a particulate abrasive, a water-soluble surface active agent, a complexing agent, and a corrosion inhibitor. The ionic character of the surface active material (e.g., cationic, anionic, or nonionic) is selected based on the zeta potential of the particulate abrasive. A CMP method for polishing a GST alloy-containing substrate utilizing the composition is also disclosed. |
申请公布号 |
US8778211(B2) |
申请公布日期 |
2014.07.15 |
申请号 |
US201213551423 |
申请日期 |
2012.07.17 |
申请人 |
Cabot Microelectronics Corporation |
发明人 |
Stender Matthias;Whitener Glenn;Nam Chul Woo |
分类号 |
C09K13/00;C09K13/04;C03C15/00;C03C25/68;H01L21/302;H01L21/461 |
主分类号 |
C09K13/00 |
代理机构 |
|
代理人 |
Omholt Thomas E;Ross Robert J;Weseman Steven D |
主权项 |
1. An aqueous chemical-mechanical polishing (CMP) composition for polishing germanium-antimony-tellurium (GST) alloys, the composition comprising an aqueous carrier containing:
(a) a particulate abrasive selected from the group consisting of a colloidal silica abrasive and ceria abrasive; (b) a water soluble surface active material; (c) an amino acid corrosion inhibitor; and (d) a complexing agent; wherein the surface active material is selected based on the zeta potential of the particulate abrasive, such that when the abrasive has a positive zeta potential, the surface active material comprises a cationic material, and when the particulate abrasive has a negative zeta potential, the surface active material comprises an anionic material, a nonionic material, or a combination thereof. |
地址 |
Aurora IL US |