发明名称 Nonvolatile semiconductor memory device and method of manufacturing the same
摘要 According to one embodiment, a nonvolatile semiconductor memory device includes sheet-like memory strings arranged in a matrix shape substantially perpendicularly to a substrate. A control gate electrode film includes a common connecting section that extends in a first direction and an electrode forming section that is provided for each of memory cells above or below a floating gate electrode film via an inter-electrode dielectric film to project from the common connecting section in a second direction. The floating gate electrode film extends in the second direction and is formed on a first principal plane of a sheet-like semiconductor film via a tunnel dielectric film.
申请公布号 US8779499(B2) 申请公布日期 2014.07.15
申请号 US201213352693 申请日期 2012.01.18
申请人 Kabushiki Kaisha Toshiba 发明人 Kiyotoshi Masahiro
分类号 H01L29/788 主分类号 H01L29/788
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A nonvolatile semiconductor memory device comprising sheet-like memory strings arranged in a matrix shape substantially perpendicularly to a substrate, wherein each of the memory strings includes, in a height direction of a sheet-like semiconductor film, a plurality of memory cells each including a tunnel dielectric film, a floating gate electrode film, an inter-electrode dielectric film, and a control gate electrode film on a first principal plane of the sheet-like semiconductor film, the control gate electrode film includes a common connecting section that connects the control gate electrode films of the memory cells at same height of the memory strings arranged in a first direction and extends in the first direction, and an electrode forming section that is provided for each of the memory cells above or below the floating gate electrode film via the inter-electrode dielectric film to project from the common connecting section in a second direction orthogonal to the first direction, the floating gate electrode film has a shape extending in the second direction and is formed on the first principal plane of the sheet-like semiconductor film via the tunnel dielectric film, and the memory cell has structure in which the floating gate electrode film is held, via the inter-electrode dielectric film, between the electrode forming sections of the upper and lower control gate electrode films.
地址 Tokyo JP