发明名称 SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent damages of a substrate due to movement of electric charges during processing by a process liquid.SOLUTION: In a substrate processing apparatus 10, a temperature of an electricity removal liquid in which its specific resistance gradually decreases with an increase in the liquid temperature, is controlled by a temperature control part 61, and the specific resistance of the electricity removal liquid becomes larger than that of a processing liquid (SPM liquid) used for the processing in a sheet processing apparatus 1. The electricity removal liquid is reserved in an electricity removal liquid reservoir part 71. Then a plurality of substrates 9 held by a cartridge 73, are immersed in the electricity removal liquid inside the electricity removal liquid reservoir part 71, and main surfaces on both sides of the substrates 9 are brought into contact with the electricity removal liquid over the entire surfaces. Thus, electricity is removed relatively gently from the substrates 9. Then, after the end of electricity removal processing and the drying processing by a substrate drying part 75, in the sheet processing apparatus 1, the SPM liquid is supplied onto an upper surface 91 of the substrate 9, and SPM processing is performed. Thus, during the SPM processing, a large amount of electric charges are prevented from rapidly moving from the substrate 9 to the SPM liquid, and damages of the substrate 9 are prevented.
申请公布号 JP2014130872(A) 申请公布日期 2014.07.10
申请号 JP20120286859 申请日期 2012.12.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MIYAGI MASAHIRO
分类号 H01L21/304 主分类号 H01L21/304
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