CURRENT APPLICATION DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

摘要

Provided is a current application device capable of applying a test current of a magnitude necessary for testing of a semiconductor element without any trouble. A current application device 1 is configured to have a contacting section having a plurality of projections 21 for contacting a contact region 24 inside an active region 23 of a semiconductor element 22 and applying the test current thereto, and a pressing section 3 which presses the contacting section 2 against the semiconductor element 22 such that each projection 21 contacts the contact region 24. A plurality of the projections 21 are arranged such that an arrangement density of outside projections 21 is larger than the arrangement density of inside projections 21.

主权项

1. A current application device, comprising:
a contacting section which includes a plurality of projections for contacting a contact region within an active region of a semiconductor element and for applying a test current thereto, in which an arrangement density of outside projections among the plurality of the projections becomes larger than an arrangement density of inside projections; and a pressing section which presses the contacting section against the semiconductor element such that the plurality of the projections contact the contact region.