| 发明名称 |
APPARATUS AND METHOD FOR TREATING SUBSTRATE |
| 摘要 |
Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed, a plasma treatment unit supplying plasma to treat a top surface of the wafer, and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit. |
| 申请公布号 |
US2014190513(A1) |
申请公布日期 |
2014.07.10 |
| 申请号 |
US201414146314 |
申请日期 |
2014.01.02 |
| 申请人 |
PSK INC. |
发明人 |
Lee Jongjin;Park Bum Joon;Kim Tae Hoon;Lee Chang Weon;Yim Sunwoong;Lee Han Kyu |
| 分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate treatment apparatus comprising:
a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed; a plasma treatment unit supplying plasma to treat a top surface of the wafer; and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit. |
| 地址 |
Gyeonggi-do KR |
