发明名称 APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT
摘要 Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
申请公布号 US2014191019(A1) 申请公布日期 2014.07.10
申请号 US201214240220 申请日期 2012.12.13
申请人 Chen Tianniu;Korzenski Michael B.;Jiang Ping 发明人 Chen Tianniu;Korzenski Michael B.;Jiang Ping
分类号 B23K1/018;B09B5/00 主分类号 B23K1/018
代理机构 代理人
主权项 1. An apparatus for processing e-waste, said apparatus comprising: (a) a mechanical solder removal module; and (b) a chemical solder removal module; wherein the modules are contiguously attached to one another.
地址 Westford MA US