发明名称 |
APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT |
摘要 |
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. |
申请公布号 |
US2014191019(A1) |
申请公布日期 |
2014.07.10 |
申请号 |
US201214240220 |
申请日期 |
2012.12.13 |
申请人 |
Chen Tianniu;Korzenski Michael B.;Jiang Ping |
发明人 |
Chen Tianniu;Korzenski Michael B.;Jiang Ping |
分类号 |
B23K1/018;B09B5/00 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus for processing e-waste, said apparatus comprising:
(a) a mechanical solder removal module; and (b) a chemical solder removal module; wherein the modules are contiguously attached to one another. |
地址 |
Westford MA US |