发明名称 MEMORY DEVICE AND METHOD OF FABRICATING THEREOF
摘要 Subject matter disclosed herein relates to a process flow to form a gate structure of a memory device.
申请公布号 US2014191307(A1) 申请公布日期 2014.07.10
申请号 US201414207035 申请日期 2014.03.12
申请人 Micron Technology, Inc. 发明人 Albini Giulio;Bacciaglia Paola
分类号 H01L29/49 主分类号 H01L29/49
代理机构 代理人
主权项 1. A memory device comprising: a gate stack disposed on a semiconductor substrate, the gate stack including: a hard mask layer;a control gate layer; anda conducting material layer covered by the hard mask layer; and spacers covering sides of the conducting material layer while exposing sides of the control gate layer, wherein the conducting material layer comprises TaN.
地址 Boise ID US