发明名称 STRUCTURE FOR ALIGNING GAS BLOW HOLE AND SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To almost concentrically and circularly blow gas to an entire face of a conveyed article such as a printed circuit board and a semiconductor wafer by devising arrangement of a gas blow hole, and heat or cool the entire face of the conveyed article more uniformly.SOLUTION: In an upper and lower region on one side with a center portion orthogonal to a conveying direction in a cross-shaped region of a gas blowing opening plate as a reference, a second arranging pattern of a gas blowing hole is provided linear-symmetrical to a first arranging pattern of the gas blowing hole. In an upper and lower region on the other side in the cross-shaped region of the gas blowing opening plate, the first arranging pattern is provided linear-symmetrical to the second arranging pattern of the gas blowing hole, so that arranging patterns diagonally aligned in the cross-shaped region of the gas blowing opening plate are identical to each other.
申请公布号 JP2014130937(A) 申请公布日期 2014.07.10
申请号 JP20120288293 申请日期 2012.12.28
申请人 SENJU METAL IND CO LTD 发明人 HIYAMA TSUTOMU
分类号 H05K3/34;B23K1/008;B23K3/04;B23K101/40;B23K101/42 主分类号 H05K3/34
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