发明名称 FINE-GRAIN BANDING-FREE FIREPROOF METAL SPUTTERING TARGET WITH UNIFORMLY RANDOM CRYSTAL ORIENTATION, METHOD OF MANUFACTURING SUCH FILM, AND THIN FILM-BASED DEVICE AND PRODUCT MANUFACTURED THEREFROM
摘要 PROBLEM TO BE SOLVED: To provide a technique for manufacture in the form of a desired microstructure directly on a used backing plate regardless of pre-removal from the backing plate while the technique can be used to reproduce or repair a sputtering target.SOLUTION: There is provided a process of manufacturing a sputtering target assembly in an additional configuration, the process including a step of vapor-depositing a target powder material directly on a backing plate or backing tube through powder spray. The target has a fine and uniform isometric grain structure of less than 44 microns, is substantially free of any inter-particle diffusion when measured through electron back-scattering diffraction (EBSD) and free of selected texture orientation, and does not show banding of a particle size or texture through the whole target body.
申请公布号 JP2014129599(A) 申请公布日期 2014.07.10
申请号 JP20130266839 申请日期 2013.12.25
申请人 HC STARCK INC;HC STARCK GMBH 发明人 MILLER STEVEN A;KUMAR PRABHAT;WU RICHARD;SUN SHUWEI;ZIMMERMANN STEFAN;SCHMIDT-PARK OLAF
分类号 C23C14/34;B22F3/24;C22C1/02;C22C1/04;C22C9/00;C22C14/00;C22C16/00;C22C27/02;C22C27/04;C22C30/00;C23C24/04 主分类号 C23C14/34
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