| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed circuit board including a copper foil layer that is surface-treated with a Pb-free solder having the same height as the height of a solder resist, and to provide a surface treatment method of a printed circuit board.SOLUTION: According to the present invention, surface treatment of a package board or an interposer board having an ultrafine pitch (300μm or less) can be easily implemented by an inexpensive process. By using a Pb-free solder, surface treatment of a printed circuit board can be implemented in an environmentally friendly process; and surface treatment of a package board or an interposer board based on an organic substance that is sensitive to high temperature can be easily carried out.</p> |
