发明名称 |
THERMOSETTING SILICONE COMPOSITION AND LIQUID GIVING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting silicone composition giving a cured product which can be suitably used for sealing an LED chip and has good curability and high gas barrier properties.SOLUTION: A thermosetting silicone composition is a mixture of: (A) a phenylmethyl silicone which has, in one molecule, at least two silicon atoms to which a hydroxyl group or an alkoxy group is bonded; (B) a silane or siloxane compound which has, in one molecule, three or more hydroxyl groups or alkoxy groups and in which an organic group bonded to a silicon atom is a methyl group; and (C) a Ga compound and a Zr compound. The thermosetting silicone composition contains phenyl groups and methyl groups which are bonded to silicon atoms at a molar ratio of 2:8 to 4.5:5.5 (the number of moles of the phenyl group to the number of moles of the methyl group). |
申请公布号 |
JP2014129515(A) |
申请公布日期 |
2014.07.10 |
申请号 |
JP20130241091 |
申请日期 |
2013.11.21 |
申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
TERADA NORIAKI;TAKIZAWA KENICHI;MORI HIROSHI;WATABE TAKUMI;KIMURA AKINORI;ANDO MASATO;TANAKA TOSHIYUKI;UENO NOBUHIKO |
分类号 |
C08L83/06;C08G77/38;C08G85/00;C08K5/07;C08K5/098;C08K5/5419;H01L33/56 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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