发明名称 THERMOSETTING SILICONE COMPOSITION AND LIQUID GIVING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting silicone composition giving a cured product which can be suitably used for sealing an LED chip and has good curability and high gas barrier properties.SOLUTION: A thermosetting silicone composition is a mixture of: (A) a phenylmethyl silicone which has, in one molecule, at least two silicon atoms to which a hydroxyl group or an alkoxy group is bonded; (B) a silane or siloxane compound which has, in one molecule, three or more hydroxyl groups or alkoxy groups and in which an organic group bonded to a silicon atom is a methyl group; and (C) a Ga compound and a Zr compound. The thermosetting silicone composition contains phenyl groups and methyl groups which are bonded to silicon atoms at a molar ratio of 2:8 to 4.5:5.5 (the number of moles of the phenyl group to the number of moles of the methyl group).
申请公布号 JP2014129515(A) 申请公布日期 2014.07.10
申请号 JP20130241091 申请日期 2013.11.21
申请人 MITSUBISHI CHEMICALS CORP 发明人 TERADA NORIAKI;TAKIZAWA KENICHI;MORI HIROSHI;WATABE TAKUMI;KIMURA AKINORI;ANDO MASATO;TANAKA TOSHIYUKI;UENO NOBUHIKO
分类号 C08L83/06;C08G77/38;C08G85/00;C08K5/07;C08K5/098;C08K5/5419;H01L33/56 主分类号 C08L83/06
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