Rotor disk for receiving single-crystal silicon, for reciprocal processing between work disk units of double-side polishing apparatus, has damping element arranged between exterior portion and inner portion and made of non-metal material

摘要

The disk has an exterior portion (1) comprising a gearing (4) rotating around a circumference of the rotor disk and made of a metal material, which has an elastic modulus of about 100 kilonewtons per square millimeter. An inner portion (2) includes recesses (5) for receiving a semiconductor wafer and made of a non-metal material. A damping element (3) is arranged between the exterior portion and the inner portion and made of a non-metal material, which has an elastic modulus of about 0.01-10 kilonewtons per square millimeter. The non-metal material is glass-fiber reinforced plastic material or a carbon fiber-strengthened plastic material. An independent claim is also included for a method for simultaneously polishing two sides of semiconductor wafers between an upper rotating polishing plate and a lower rotating polishing plate of a double-side polishing apparatus.