LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

摘要

A liquid ejecting head includes: a pressure generation chamber that communicates with a nozzle opening which ejects liquid; a pressure generation unit that causes a change in pressure in the pressure generation chamber; and a flexible wiring substrate that transmits a control signal from outside and includes a wiring layer which is connected to each individual electrode of a plurality of pressure generation units and also connected to a terminal portion of a common electrode common to the plurality of pressure generation units. In the liquid ejecting head, the wiring layer of the wiring substrate includes slits in an area connected to the terminal portion of the common electrode of the pressure generation unit, while the wiring layer of the wiring substrate and the terminal portion of the pressure generation unit are connected via an anisotropic conductive material.

主权项

1. A liquid ejecting head comprising:
a pressure generation chamber that communicates with a nozzle opening which ejects liquid; a pressure generation unit that causes a change in pressure in the pressure generation chamber, the pressure generation unit having an individual electrode which is electrically connected to an individual terminal portion and a common electrode which is electrically connected to a common terminal portion that is common to a plurality of pressure generation units; and a wiring substrate that includes a first wiring layer which is connected to the individual terminal portion of the pressure generation unit and a second wiring layer which is connected to the common terminal portion of the pressure generation unit, the wiring substrate has flexibility, wherein at least one of the second wiring layer and the common terminal portion has slits at an area which the second wiring layer and the common terminal portion are connected in electrically, and the second wiring layer of the wiring substrate and the common terminal portion of the pressure generation unit are connected via an anisotropic conductive material in the area.