| 发明名称 |
INTEGRATED CIRCUIT PACKAGE |
| 摘要 |
An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe. |
| 申请公布号 |
US2014191378(A1) |
申请公布日期 |
2014.07.10 |
| 申请号 |
US201313734246 |
申请日期 |
2013.01.04 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Lee Han Meng@Eugene Lee;Abdul Aziz Anis Fauzi;Khoo Yien Sien |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit (IC) package comprising:
a bottom leadframe; an interposer mounted on said bottom leadframe; a flipchip die mounted on said interposer; and a top leadframe electrically connected to said interposer. |
| 地址 |
Dallas TX US |
