发明名称 LASER SYSTEM WITH POLARIZED OBLIQUE INCIDENCE ANGLE AND ASSOCIATED METHODS
摘要 Novel laser processed semiconductor materials, systems, and methods associated with the manufacture and use of such materials are provided. In one aspect, for example, a method of processing a semiconductor material can include providing a semiconductor material and irradiating a target region of the semiconductor material with a beam of laser radiation to form a laser treated region. The laser radiation is irradiated at an angle of incidence relative to the semiconductor material surface normal of from about 5° to about 89°, and the laser radiation can be at least substantially p-polarized.
申请公布号 US2014191354(A1) 申请公布日期 2014.07.10
申请号 US201414209592 申请日期 2014.03.13
申请人 SiOnyx, Inc. 发明人 Vineis Christopher
分类号 H01L31/18;H01L31/0236 主分类号 H01L31/18
代理机构 代理人
主权项 1. A method of processing a semiconductor material, comprising: providing a semiconductor material; irradiating a target region of the semiconductor material with a beam of laser radiation to form a laser treated region, wherein the laser radiation is irradiated at an angle of incidence relative to the semiconductor material surface normal of from about 5° to about 89°, and wherein the laser radiation is substantially p-polarized.
地址 Beverly MA US