发明名称 |
LASER SYSTEM WITH POLARIZED OBLIQUE INCIDENCE ANGLE AND ASSOCIATED METHODS |
摘要 |
Novel laser processed semiconductor materials, systems, and methods associated with the manufacture and use of such materials are provided. In one aspect, for example, a method of processing a semiconductor material can include providing a semiconductor material and irradiating a target region of the semiconductor material with a beam of laser radiation to form a laser treated region. The laser radiation is irradiated at an angle of incidence relative to the semiconductor material surface normal of from about 5° to about 89°, and the laser radiation can be at least substantially p-polarized. |
申请公布号 |
US2014191354(A1) |
申请公布日期 |
2014.07.10 |
申请号 |
US201414209592 |
申请日期 |
2014.03.13 |
申请人 |
SiOnyx, Inc. |
发明人 |
Vineis Christopher |
分类号 |
H01L31/18;H01L31/0236 |
主分类号 |
H01L31/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of processing a semiconductor material, comprising:
providing a semiconductor material; irradiating a target region of the semiconductor material with a beam of laser radiation to form a laser treated region, wherein the laser radiation is irradiated at an angle of incidence relative to the semiconductor material surface normal of from about 5° to about 89°, and wherein the laser radiation is substantially p-polarized. |
地址 |
Beverly MA US |