发明名称 |
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS |
摘要 |
Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second substrate, with at least one of the first substrate and the second substrate having a plurality of solid-state transducers. The second substrate can include a plurality of projections and a plurality of intermediate regions and can be bonded to the first substrate with a discontinuous bond. Individual solid-state transducers can be disposed at least partially within corresponding intermediate regions and the discontinuous bond can include bonding material bonding the individual solid-state transducers to blind ends of corresponding intermediate regions. Associated methods and systems of discontinuous bonds for semiconductor devices are disclosed herein. |
申请公布号 |
EP2751831(A2) |
申请公布日期 |
2014.07.09 |
申请号 |
EP20120827286 |
申请日期 |
2012.08.14 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
SCHELLHAMMER, SCOTT, D.;ODNOBLYUDOV, VLADIMIR;FREI, JEREMY, S. |
分类号 |
H01L21/20;H01L21/02;H01L21/18;H01L21/447;H01L23/00;H01L23/495;H01L33/00;H01L33/62;H01S5/00 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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