发明名称 Method and apparatus of core timing prediction of core logic in the chip-level implementation process through an over-core window on a chip-level routing layer
摘要 A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.
申请公布号 US8775995(B2) 申请公布日期 2014.07.08
申请号 US201213657000 申请日期 2012.10.22
申请人 LSI Corporation 发明人 Molina Ruben Salvador;Tetelbaum Alexander
分类号 G06F17/50 主分类号 G06F17/50
代理机构 Raj Abhyanker, P.C. 代理人 Raj Abhyanker, P.C.
主权项 1. A method of a chip-level implementation process, comprising: filling un-wired tracks of each core logic in a chip with grounded metal; filling un-wired tracks of a chip-level routing layer adjacent to an outermost layer of the each core logic with the grounded metal in a direction orthogonal to a preferred direction of the un-wired tracks in the outermost layer of the each core logic; constraining the grounded metal of the chip-level routing layer to be within a planar area of a core window along the chip-level routing layer that exactly corresponds in size to a planar area along the outermost layer of the each core logic comprising the grounded metal thereof; and generating, through a processor, a core timing model of the each core logic in the chip following the filling of the un-wired tracks of the each core logic and the un-wired tracks of the chip-level routing layer and the constraining of the grounded metal of the chip-level routing layer.
地址 Milpitas CA US