CARRIER PLATE FOR MANUFACTURING SEMICONDUCTOR CHIP

摘要

The present invention relates to a carrier plate for manufacturing a semiconductor chip. The carrier plate for manufacturing a semiconductor chip according to the present invention comprises a chip holding area which is prepared at a predetermined area of the carrier plate and includes a metal plate with a plurality of through holes for inserting and fixing the semiconductor chip therein; and an absorption area, which is prepared outside the chip holding area, for absorption and fixation by an absorption pad. A plurality of grooves for enhancing an adhesive force between a mother material (metal plate) and silicon are formed on both of upper and lower surfaces of the absorption area. According to the present invention, a surface of the absorption area outside the chip holding area of the carrier plate is processed into an uneven structure by using a half etching method rather than a conventional full etching method, such that the adhesive force between a mother material (plate) and silicon is improved while forming silicon on the carrier plate.