发明名称 ETCHANT COMPOSITION FOR COPPER-CONTAINING METAL LAYER AND PREPARING METHOD OF AN ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY USING SAME
摘要 The invention relates to an etchant composition for copper-containing metal layer, more specifically, to a etchant composition for copper-containing metal layer, which has a remarkably improved stability by comprising hydrogen peroxide (H2O2), soluble compound having N-H bond and carboxyl group in a molecule, and diethylene triamine pentaacetic acid or salt thereof, and a manufacturing method of an array substrate for liquid crystal display using the same.
申请公布号 KR20140086656(A) 申请公布日期 2014.07.08
申请号 KR20120157397 申请日期 2012.12.28
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 KWON, O BYOUNG;KIM, DONG KI;LEE, JI YEON
分类号 C23F1/18;H05K3/06 主分类号 C23F1/18
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