Method for mounting a component

摘要

A component mounting apparatus including: plural spindles respectively including nozzles, each spindle rotating about a first pivot and each nozzle picking up a component; a head body rotating about a second pivot substantially parallel to a first pivot and rotatably supporting the spindles; and a controller controlling the spindles and the head body to perform: a pickup operation in which the spindle rotates about the first pivot from an initial orientation to a pickup orientation, the nozzle picks up the component, and the spindle rotates from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate; and a mounting operation in which the picked-up component is transferred to a mounting position of the substrate during which each spindle is retained at the initial orientation.

主权项

1. A method of mounting a component using an apparatus comprising a plurality of spindles respectively comprising nozzles, each of which is configured to rotate about a first pivot provided at a center of the each spindle, a head body which is configured to rotate about a second pivot provided at a center of the head body and substantially parallel to the first pivot, and the head body configured to rotatably support the spindles, and a controller configured to control the spindles and the head body to perform the method, the method comprising:
performing a pickup operation comprising:
rotating the spindle about the first pivot from an initial orientation to a pickup orientation with respect to the head body;picking up the component; androtating the spindle from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate,wherein the rotating the spindle about the first pivot from the initial orientation to the pickup orientation occurs before the picking up the component; and performing a mounting operation comprising transferring the picked-up component to a mounting position of the substrate during which each of the spindles is retained at the initial orientation with respect to the head body.