| 摘要 |
The present invention relates to a semiconductor package and a method for fabricating the same. The semiconductor package of the present invention includes: a semiconductor substrate having a plurality of bonding pads which are arranged separately from each other; an insulating layer formed on the upper surface of the semiconductor substrate to have an opening part for exposing the bonding pads; a metal base layer formed on the upper part of the insulating layer and the bonding pads; a solder pump formed on the upper part of the metal base layer to electrically touch the bonding pads; and an etch stop layer formed on the upper part of the base layer to wound around the solder pump. According to the present invention, the generation of an undercut can be minimized when the metal base layer is etched. |
