发明名称 |
Resin composition and image display apparatus |
摘要 |
A thin image display apparatus capable of high luminance and high contrast display of a display part, which does not produce display defects resulting from deformation of the image display part. The thin image display apparatus has an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the image display part and the protective part. The cured resin layer has a transmittance in the visible region of 90% or higher and a storage modulus at 25° C. of 1.0×107 Pa or less. The cured resin layer is formed from a resin composition which has a curing shrinkage ratio of 5.0% or less. |
申请公布号 |
US8773624(B2) |
申请公布日期 |
2014.07.08 |
申请号 |
US200812450108 |
申请日期 |
2008.04.09 |
申请人 |
Sony Chemical & Information Device Corporation |
发明人 |
Shinya Yoshihisa;Kamata Yusuke |
分类号 |
G02F1/1333;G02F1/1339;C09J133/06;C09J109/00;G02F1/1335;C08L51/04;C08L45/00;C08L19/00 |
主分类号 |
G02F1/1333 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A method for producing an image display apparatus comprising the steps of:
allowing a photocurable resin composition to be arranged between a base having an image display part and a light-transmitting protective part having a shielding part; forming a cured resin layer by photocuring the curable resin composition, wherein, as the photocurable resin composition, a resin composition is used for forming a cured resin layer that is arranged between an image display part of an image display apparatus and a light-transmitting protective part, the resin composition having a curing shrinkage ratio of 5.0% or less, a 100 μm-thick cured resin formed by curing the resin composition having a transmittance in the visible region of 90% or higher and the resin composition having a storage modulus at 25° C. of 1×107 Pa or less; allowing a curable resin composition containing a thermal polymerization initiator to be arranged at least between the shielding part and the base; and heating the curable resin composition. |
地址 |
Tokyo JP |