发明名称 | Connector | ||
摘要 | To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost.;A connector 10 includes a substrate 1 with an electronic component 3 mounted thereon, a terminal 4 which is electrically connected to the substrate 1, and a housing 5 comprised of synthetic resin and attached with the substrate 1 and the terminal 4. In addition, the electronic component 3 and the terminal 4 are electrically connected to the substrate 1 by reflow soldering using a lead-free solder 2. The connector 10 is fabricated by insert-molding the substrate 1 and the terminal 4 in the housing 5. Furthermore, the substrate 1 and the electronic component 3 are embedded in the synthetic resin of the housing 5. | ||
申请公布号 | US8770988(B2) | 申请公布日期 | 2014.07.08 |
申请号 | US201013498236 | 申请日期 | 2010.10.05 |
申请人 | Yazaki Corporation | 发明人 | Furukawa Koji |
分类号 | H01R12/00 | 主分类号 | H01R12/00 |
代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
主权项 | 1. A connector comprising: a substrate on which an electronic component is mounted; a terminal which is electrically connected to the substrate; and a housing comprised of a synthetic resin, to which the substrate and the terminal are attached; wherein the electronic component mounted on the substrate and a solder junction portion between the electronic component and the terminal are coated by a liquid curable resin, and the substrate and the terminal are insert-molded in the housing, wherein a linear coefficient expansion of the liquid curable resin is intermediate between a linear coefficient expansion of a material constituting the substrate and a linear coefficient expansion of the synthetic material constituting the housing. | ||
地址 | Tokyo JP |