| 发明名称 | Sample contamination method | ||
| 摘要 | A sample contamination method according to an embodiment includes spraying a chemical solution containing contaminants into a casing, carrying a semiconductor substrate into the casing filled with the chemical solution by the spraying, leaving the semiconductor substrate in the casing filled with the chemical solution for a predetermined time, and carrying the semiconductor substrate out of the casing after the predetermined time passes. | ||
| 申请公布号 | US8771535(B2) | 申请公布日期 | 2014.07.08 |
| 申请号 | US201113188719 | 申请日期 | 2011.07.22 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Yamada Yuji;Katano Makiko;Mizuno Ayako;Uemura Eri;Uchinuno Asuka;Takeuchi Chikashi |
| 分类号 | H01L21/66;G01N1/28 | 主分类号 | H01L21/66 |
| 代理机构 | Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. | 代理人 | Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
| 主权项 | 1. A sample contamination method, comprising: introducing a chemical solution containing metal contaminants in the form of chemical liquid drops into a casing; carrying a semiconductor substrate in a state of lying on a substrate container into the casing filled with the chemical liquid drops; leaving the semiconductor substrate in the casing filled with the chemical liquid drops for a first predetermined time; and carrying the semiconductor substrate out of the casing after the first predetermined time passes. | ||
| 地址 | Tokyo JP | ||