发明名称 ELECTROCONDUCTIVE THERMOPLASTIC RESIN COMPOSITION AND ITS MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide an electroconductive thermoplastic resin composition capable of stably providing a surface intrinsic resistivity of 10&OHgr;/sq. or less, preferably 10to 10&OHgr;/sq. without variation in blending with reducing an addition amount of a conductive filler for suppressing the increase of a specific gravity of materials.SOLUTION: There is provided an electroconductive thermoplastic resin composition obtained by blending 100 pts.mass of a resin component consisting of total 100 mass% of a polycarbonate resin (A) of 20 to 70 mass%, a styrenic resin (B) of 80 to 30 mass% containing a graft copolymer obtained by graft copolymerizing an aromatic alkenyl compound monomer and vinyl cyanide compound monomer in a presence of a rubbery polymer (Bg) and a hard copolymer obtained by copolymerizing a vinyl cyanide compound monomer and an aromatic alkenyl compound monomer (Br), 5.0 to 10.0 pts.mass of a conductive inorganic filler (C) and 1.5 to 30 pts.mass of a conductive polymer containing alkylene oxide as a monomer unit (D). There is also provided a molded article thereof.
申请公布号 JP2014125608(A) 申请公布日期 2014.07.07
申请号 JP20120285411 申请日期 2012.12.27
申请人 UMG ABS LTD 发明人 ONO MASAKI;KAWAGUCHI EIICHIRO;NAKAMOTO MASAHITO
分类号 C08L51/04;C08K3/00;C08L69/00 主分类号 C08L51/04
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