| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure of a printed circuit board which makes a fluid substance less likely to leak and inhibits deterioration of heat radiation efficiency even when the fluid substance such as a heat radiation grease is used as a heat conduction material.SOLUTION: A heat radiation structure 1 of a printed circuit board includes: a printed circuit board 2 having through vias 7; a housing 4 placed at a position facing the printed circuit board 2; and a heat conduction material 5 which buries a gap between the printed circuit board 2 and the housing 4. The through vias 7 facing the heat conduction material 5 are filled with a filler 8 for blocking the heat conduction material 5 from flowing thereinto. |
