| 摘要 |
PROBLEM TO BE SOLVED: To enhance transmission characteristics of signal by reducing resonance.SOLUTION: A high frequency component includes an insulating substrate 11, a signal pattern 12 and a first ground pattern 13 provided on the upper surface of the insulating substrate 11, and a second ground pattern 15 provided in the insulating substrate 11 or on the lower surface thereof. The second ground pattern 15 is connected to the lower end of a via conductor 14, and located below the signal pattern 12. In the plan view, the second ground pattern 15 has such a shape that at least a region overlapping a first end 13a, out of the region overlapping the first ground pattern 13, is removed. |
