发明名称 METHOD FOR MANUFACTURING COMPONENT, DEVICE FOR PEELING JUNCTION, AND COMPOSITE CARRIER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a component, which prevents the component from being damaged due to attachment of carbon-based substance resulting from volatilization of solvent from an adhesion layer in processing the component to be processed on a composite carrier, so as to increase the adhesive force between the transport carrier and the component to be processed, allowing for expansion of processing temperature range for the component to be processed.SOLUTION: The method includes: steps S101 and S102 of removing solvent from an adhesive by heating a component to be processed with adhesive attached thereto at a temperature equal to or higher than the boiling point of the solvent; steps S103 and S104 of laminating a transport carrier and the component to be processed through an adhesive, and heating the laminate under pressure so as to make a composite carrier formed of the transport carrier and the component to be processed which are joined through an adhesive layer; a step S105 of manufacturing a component by processing the component to be processed on the composite carrier; and a step S106 of heating the composite carrier so as to peel the component manufactured in the step S105 from the transport carrier of the composite carrier.
申请公布号 JP2014125505(A) 申请公布日期 2014.07.07
申请号 JP20120281560 申请日期 2012.12.25
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;AYUMI KOGYO KK;NEW INDUSTRY RESEARCH ORGANIZATION 发明人 ITAYA TARO;ISHII HIROYUKI;ABE HIDEYUKI;ODA TOMOHIRO;AKITA KAZUMICHI;KOSAKA NORIYUKI
分类号 C09J201/00;C09J11/04;C09J11/06;C09J179/08;H01L21/683 主分类号 C09J201/00
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