PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed circuit board and a method for manufacturing the same are disclosed. The printed circuit board includes a core layer; a metal bump which is embedded in the core layer and of which one surface is opened to the outside; and a solder resist layer which is disposed on the core layer and includes an opening part. The printed circuit board solves a problem of an empty space between the bumps without a new solder resist process by using a separation substrate manufacturing method and filling the empty space between the bumps with an insulating material rather than solder resist.