发明名称 TENSION-ADJUSTMENT DEVICE AND APPARATUS FOR POLISHING WAFER INCLUDING THE SAME
摘要 Disclosed are a tension-adjustment device which notifies the replacement time and the abrasion degree of a belt which receives the power of a driving motor, and an apparatus for polishing a wafer including the same. A tension-adjustment device according to an embodiment includes a tensioner which touches the belt and maintains the tension of the belt; a sensor which is connected to the tensioner and senses the position of the tensioner; and a control part which interlinks with the sensor, receives the signal of the sensor, and generates an alarm sound. The tensioner includes a receiving part which has an elastic body therein, a guide bar which is partly arranged in the receiving part, and a guide roller which is combined with one end of the guide bar and touches the belt.
申请公布号 KR20140083318(A) 申请公布日期 2014.07.04
申请号 KR20120152912 申请日期 2012.12.26
申请人 LG SILTRON INCORPORATED 发明人 LEE, JIN SEOB;PARK, CHI HO
分类号 H01L21/304 主分类号 H01L21/304
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