摘要 |
A wiring board is fabricated through the following steps: (A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal; (B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal; (C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and (D) etching off the carrier metal foil and the thin layer at desired parts thereof. d |
申请人 |
HITACHI CHEMICAL CO., LTD., TOKIO/TOKYO, JP |
发明人 |
FUKUTOMI, NAOKI, IBARAKI-KEN,, JP;NAKAYAMA, HAJIME, MATSUSHIRO, TSUKUBA-SHI, IBARAKI-KEN,, JP;TSUBOMATSU, YOSHIAKI, IBARAKI-KEN,, JP;KAITOU, KOUICHI, IBARAKI-KEN, JP;YOSHIDOMI, YASUNOBU, SHIMODATE-SHI, IBARAKI-KEN,, JP;TAKAHASHI, YOSHIHIRO, HANABATAKE, TSUKUBA-SHI, IBARAKI-KEN,, JP |