发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent mist of process liquid dispersed from a wafer from returning to the wafer.SOLUTION: A substrate processing apparatus includes a rotation cup (20) surrounding a substrate (W) held by a substrate holding part (10) and rotating along with the substrate holding part, for guiding a processing liquid dispersed from the rotating substrate, and a non-rotating outer cup (31) provided so as to surround the rotation cup via a gap, and having an inner space for receiving the processing liquid guided by the rotation cup. The height of the upper edge of the rotation cup is higher than the height of the upper edge of the outer cup, and the upper edge of the outer peripheral surface of the rotation cup is provided with an outside projection (20c) projecting outward in a radial direction of the rotation cup and extending in a circumferential direction thereof. The outside projection blocks mist of the processing liquid jumping out from the gap between the rotation cup (20) and the outer cup toward above the substrate.
申请公布号 JP2014123713(A) 申请公布日期 2014.07.03
申请号 JP20130205418 申请日期 2013.09.30
申请人 TOKYO ELECTRON LTD 发明人 AIURA KAZUHIRO;ITO KIKO;NAKAO HIDETOSHI;SHINOHARA KAZUYOSHI;TANAKA AKIRA;YOSHIDA YUKI;AIHARA AKINORI
分类号 H01L21/304;H01L21/306 主分类号 H01L21/304
代理机构 代理人
主权项
地址