| 发明名称 |
ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE |
| 摘要 |
A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element. |
| 申请公布号 |
US2014183593(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314141607 |
申请日期 |
2013.12.27 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
KATAYAMA Hiroyuki;NORO Hiroshi;ITO Hisataka |
| 分类号 |
H01L33/52;H01L33/60;H01L33/50 |
主分类号 |
H01L33/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for producing an encapsulating layer-covered optical semiconductor element comprising:
a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element. |
| 地址 |
Osaka JP |
