| 摘要 |
PROBLEM TO BE SOLVED: To decrease the use area of a micromechanical element and reduce cost.SOLUTION: Surface contacts 40 that electrically contact a part of a micromechanical structure 50 of a micromechanical element 30 are provided on a back side 16 of a substrate 10 across a polysilicon layer 51, passivation layers 100, 102, and solder metallization in trench grooves 2' penetrating through the substrate 10. |
