发明名称 RESIN MOLDING APPARATUS AND METHOD FOR THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To enable the abbreviation of the cycle time of an entire apparatus while enabling the determination, even if the packaging state of electronic components atop a substrate varies, of the quantity of a resin required for resin-sealing the substrate by complying with the variation.SOLUTION: The provided apparatus includes: a memory unit 154 for memorizing a standard resin volume V1 for resin-sealing a substrate 102 on which electronic components are packaged; an electronic component detection unit 118 for detecting the packaging state of the electronic components; a resin metering unit 142 for metering a powdery/granular resin 103; and a control unit 152 for computing the added resin volume DV based on detection results of the electronic component detection unit 118 and prompting, prior to the completion of the computation of the added resin volume DV, the resin metering unit 142 to commence the metering of the powdery/granular resin 103 of the standard resin volume V1.</p>
申请公布号 JP2014121826(A) 申请公布日期 2014.07.03
申请号 JP20120278711 申请日期 2012.12.20
申请人 SUMITOMO HEAVY IND LTD 发明人 FUKUOKA MASARU
分类号 B29C45/76;B29C45/02 主分类号 B29C45/76
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