发明名称 |
ADHESIVE FOR COVERLAY FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for a coverlay film, which contains a polyvinyl acetal resin excellent in adhesion to the coverlay film.SOLUTION: The adhesive for a coverlay film is used for bonding the coverlay film to a flexible printed wiring board, and contains a polyvinyl acetal resin having a structural unit comprising an aromatic ring represented by the specified general formula (1), with the content of the structural unit comprising the aromatic ring represented by the specified general formula (1) being 40 mol% or less. In the formula (1), R represents a group comprising an aromatic ring. |
申请公布号 |
JP2014122266(A) |
申请公布日期 |
2014.07.03 |
申请号 |
JP20120278529 |
申请日期 |
2012.12.20 |
申请人 |
SEKISUI CHEM CO LTD;TOKYO UNIV OF AGRICULTURE & TECHNOLOGY |
发明人 |
YAMAGUCHI HIDEHIRO;TAKEI KIYOMI;SAITO HIROSHI |
分类号 |
C09J129/14;C08F8/28;C08F16/38;C09J7/00;C09J7/02;H05K3/28 |
主分类号 |
C09J129/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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