| 发明名称 |
UNDERFILL SEALANT COMPOSITION |
| 摘要 |
The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group. |
| 申请公布号 |
US2014187729(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201414200871 |
申请日期 |
2014.03.07 |
| 申请人 |
HENKEL AG & CO. KGAA |
发明人 |
Horiguchi Yusuke;Sano Mieko;Sato Kenichiro |
| 分类号 |
C09J133/14 |
主分类号 |
C09J133/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An underfill sealant composition comprising:
(a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group. |
| 地址 |
Duesseldorf DE |
