RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD

摘要

Disclosed herein are a resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board, the resin composition including: a composite epoxy resin containing a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, a phosphorus based epoxy resin, and an alkyl sulfonated tetrazole-modified epoxy resin; and a curing agent. The insulating film and the prepreg according to the present invention may have basically low coefficient of thermal expansion, excellent heat resistance, a high glass transition temperature, and excellent adhesion force with the metal.

主权项

1. A resin composition for a printed circuit board, the resin composition comprising:
a composite epoxy resin containing a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, a phosphorus based epoxy resin, and an alkyl sulfonated tetrazole-modified epoxy resin represented by the following Chemical Formula 1; and a curing agent. wherein, R1 is selected from aliphatic or alicyclic alkyl groups having 1 to 20 carbon atoms, aryl or aralkyl groups having 1 to 20 carbon atoms, functional group substituted alkyl or aryl groups having 1 to 20 carbon atoms, rings connected by alkylene with or without hetero atom, or a polymer compound, and derivatives thereof, R2 is a compound having at least one epoxy group per molecule, and n is an integer of 1 to 6.