发明名称 PROCESS OF MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board having high connection reliability.SOLUTION: Neighboring opening 71fc for a pad and opening 71fo for a pad are displaced in an axial direction of a wiring part and are disposed so that an opening adjacent to an opening 1 does not exist in a direction perpendicular to the axial direction. Being disposed apart in terms of distance, a short circuit is hardly generated between the neighboring opening 71fc for a pad and opening 71fo for a pad, and connection reliability with an IC chip may be enhanced.
申请公布号 JP2014123592(A) 申请公布日期 2014.07.03
申请号 JP20120277716 申请日期 2012.12.20
申请人 IBIDEN CO LTD 发明人 FURUTA TORU;TAKAGI FUMITAKA;KIMURA MARIKO
分类号 H05K3/46;H01L23/12;H05K1/18;H05K3/34 主分类号 H05K3/46
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