METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT, AND SURFACE-MOUNT COMPONENT

摘要

PROBLEM TO BE SOLVED: To eliminate melting of die-bonding solder material even when a surface-mount component formed by using the die-bonding solder material is soldered to a printed board by using mounting solder material.SOLUTION: A surface-mount component formed by using (Sn-Sb)-based high-melting-point solder material whose content of Cu is equal to or less than a predetermined value and which consists principally of Sn as die-bonding solder material 30 is soldered by using (Sn-Ag-Cu-Bi)-based solder material as mounting solder material 70 applied to a board terminal portion of a circuit board. The die-bonding solder material 30 has solidus temperature of 243°C and the mounting solder material 70 has liquidus temperature of approximately 215 to 220°C, so the die-bonding solder material 30 is not molten even at heating temperature (equal to or lower than 240°C) of a reflow furnace.